CyberOptics SE500-II SPI (2016)

CyberOptics SE500-II SPI

DOM: 2016

3D Solder Paste Inspection

Max Inspection Area: 20”x19.8”

Max PCB: 510 x 510 mm (20.0 x 20.0 in.)

Min PCB: 50 x 50 mm (2.0 x 2.0 in.)

3.0 kg (6.6 lbs.)

Board Edge Clearance: Top: 2.5 mm (0.10 in.), Bottom: 3.0 mm (0.12 in.)

Component Clearance: Top (above belt): 20.1 mm (0.78 in.), Bottom: 25.4 mm (1.0 in.)

Conveyor Speed: 150 - 450 mm/sec (5.9-17.7 in./sec)

Conveyor Width Adjust: Automatic

SMEMA

Dimensions:

39.5” x 50” x 55”H

1,433 lbs.