Vi Technology 3D SPI System

Vi Technology 3D SPI

In-line Solder Paste Inspection System

Model: 3D SPI

DOM: 06/2010

Voltage 220v, 1PH

Windows OS

Dual Light Source and On-the-fly Image scan

High power M/H light 3D Sensor

Shadow free inspection based

High-speed linear motors with closed loop high resolution linear encoders

Automatic conveyor width adjustment for boards up to 510 mm x 460 mm [20" x 18"]

Height Accuracy on certification plate: < 3 μm

Height Repeatability on certification plate: <1.5 μm at 3 Sigma

Volume Repeatability on certification plate: <2% at 3 Sigma

Gage R&R: <10%

Inspection time: 20 cm²/s (without shadow effect)

Fully Functional