BESI Datacon 2200 EVO Flexible Multi-Chip Die Bonder

BESI Datacon 2200 EVO Flexible Multi-Chip Die Bonder

Available quantity:1

orCall 833-768-8733 (Toll Free)

Description

BESI Datacon 2200 EVO Flexible Multi-Chip Die Bonder

High accuracy and high productivity

DOM: 2019

Less than 100 operating hours...VERY LOW USE!

Wafer Table

Tool Changer Unit 7 Slots

Main – Musashi Super Sigma V2

Internal Vacuum Pump

P-part at Main AXIS

Microscope

12" (FF-123) adapter for 2" and/or 4" Wafflepacks and Gelpaks (4x 2" and 2x 4")

2" WP-Adapter (12"-FF123) - 23 up - side clamp (any WT)

4" WP-Adapter - (12"-FF123) - 7 up - side clamp (std WT)

2" GP-Adapter - (12"-FF123) - 22 up - (any WT)

4" GP-Adapter - 12" (FF123) - 7 up - (std WT) 


Available Jan/Feb 2023

Specifications

ManufacturerDATACON
Model2200 EVO
Year2019
ConditionUsed
Stock Number3974182