Koh Young Aspire 2 SPI System

Koh Young Aspire 2 SPI System

DOM: 2014

3D Solder Paste Inspection System

100% 3D Paste Measurement based on the patented Shadow-Free measurement technology

High Speed 3D Measurement Intelligent user interface and SPC tool for process optimization

Metrology Capability: Volume, Area, Height, Offset, Bridging and Shape Deformity

Types of Defects: Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste Offset

10% Gage R&R on 01005 deposits

Max. PCB Size: 510 x 510 mm 20.08 x 20.08 inch

Min. PCB Size: 50 x 50 mm 1.97 x 1.97 inch

PCB Thickness: 0.016 ~ 0.20 inch

Machine Weight: 1320 lbs

Manuals Computer, Keyboard and Monitor Very Low Use!

Fully Functional!