Asscon VP7000-200 Inline Vapor Phase Soldering System

VP7000-200 Inline Vapor Phase Soldering System

DOM: 2020

Lightly Used

Process Flow: Left to Right

Max Single Board Size: 520 x 450 mm

Dynamic Profiling

NOTE: Machine has every option but chiller, configured to work with facility water

max. solder product length

loading with 2 boards: 520 mm (20.4")

loading with 3 boards: 335 mm (13.1")

loading with 4 boards: 250 mm (9.84")

loading with 6 boards: 155 mm (6.10)

Transport width max.: 450 mm

Transport width min.: 60 mm

Board format min.: 100 x 60 mm

max. solder product height: 55 mm

max. solder product height below: 20 mm

guiding rail surface: 3 mm

Transport system: Pin chain transport

Central support: Soldering and cooling area