Koh Young 3030VAL Solder Paste Inspection (SPI)

Koh Young 3030VAL SPI Vintage: 11/2007 3D Vision SMEMA conveyor with Bottom Up Side Edge Clamping Measures: Volume, Height, X/Y position, area Voltage Requirement: 200-240V Includes: (Base Unit, 1 Programming Seat, Real Time 3D viewer, Bare Board Teaching, Dual Projection, Real Time SPC, Paste Topography Mapping, CAM Converter) Defect Detection: (Insufficient Paste, Excessive Paste, Shape Deformity, No Paste, Bridging, Paste Displacement) True 3D Volume Measurement 100% Shadow-free Measurement Paste Defects Detection Unrivalled Accuracy & Repeatability True Yield Improvement Partner Easy and Intuitive Program set-up Industry-leading Inspection Speed Manage the Paste Printing Process Statistically Robust Inspection against PCB warping Extract Solder Paste Volume only Remote & Controlling Software Various Options available based on Production Line and Customer Needs Includes: (Base Unit, 1 Programming Seat, Real Time 3D viewer, Bare Board Teaching, Dual Projection, Real Time SPC, Paste Topography Mapping, CAM Converter) Defect Detection: (Insufficient Paste, Excessive Paste, Shape Deformity, No Paste, Bridging, Paste Displacement) Fully Functional