Process Flow: Left to Right
Saki BF-Frontier AOI System
Board Thickness: 0.6 - 2.5mm, 24 - 100mils
Board Warp: +/-2mm, 79mils
PCB Clearance; Top: 40mm, 1.57in Bottom: 40mm, 1.57in
Inspection Categories: Presence/Absence, Misalignment, Tomb stone, Reverse, Polarity, Bridge, Foreign material, Absence of solder, Insufficient solder, Lifted lead, Lifted Chip, and Fillet defect. Each defect name can be changed freely by system function.
Scanning Time: Approx. 24sec. (460×500mm)
Calculating Time: *Approx. 3 sec./10,000 inspection windows
PCB Loading / Unloading Time: Approx. 3 sec.
Camera (Image Processing): Line color CCD camera
Lighting: LED lighting system
Transfer Conveyor Method: Flat belt transfer
Transfer Conveyor Height: 900+/-20mm, 36+/-0.8in
Transfer Conveyor Width Adjustment: Auto
Operating System: Windows XP